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Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding.

Jiunn ChenYi-Shao LaiYi-Wun WangC. Robert Kao
Published in: Microelectron. Reliab. (2011)
Keyphrases
  • wire bonding
  • mechanical properties
  • electron microscopy
  • real time
  • stress response
  • data mining
  • experimental data