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Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics.
Y. J. Chen
C. K. Chung
C. R. Yang
C. Robert Kao
Published in:
Microelectron. Reliab. (2013)
Keyphrases
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mechanical properties
dynamic model
joint estimation
real time
databases
real world
decision trees
lower bound
relational databases
mobile robot
high temperature