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Reliability of micro-interconnects in 3D IC packages.

C. Robert KaoAlbert T. WuKing-Ning TuYi-Shao Lai
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • integrated circuit
  • input output
  • software packages
  • reliability analysis
  • neural network
  • software reliability
  • artificial intelligence
  • image processing
  • signal processing