King-Ning Tu

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 2

Top Topics

Technical Solutions

Key Technologies

Highly Accurate

Top Venues

Microelectron. Reliab.

Publications

Yulong Chen, Xiewen Wen, King-Ning Tu, Yingxia Liu
Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. ICTA (2023)
David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, King-Ning Tu
Sn in microbumps. Microelectron. Reliab. 79 (2017)
King-Ning Tu, Hsiang-Yao Hsiao, Chih Chen
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy. Microelectron. Reliab. 53 (1) (2013)
C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai
Reliability of micro-interconnects in 3D IC packages. Microelectron. Reliab. 53 (1) (2013)
King-Ning Tu
Reliability challenges in 3D IC packaging technology. Microelectron. Reliab. 51 (3) (2011)
Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu
Recent research advances in Pb-free solders. Microelectron. Reliab. 49 (3) (2009)
M. Y. Yan, King-Ning Tu, A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy
A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects. Microelectron. Reliab. 46 (8) (2006)
Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie
Three-dimensional impedance engineering for mixed-signal system-on-chip applications. CICC (2005)