Three-dimensional impedance engineering for mixed-signal system-on-chip applications.
Kyuchul ChongXi ZhangKing-Ning TuDaquan HuangMau-Chung Frank ChangYa-Hong XiePublished in: CICC (2005)
Keyphrases
- three dimensional
- mixed signal
- low power
- power consumption
- vlsi circuits
- multi channel
- hardware and software
- design space exploration
- digital circuits
- software engineering
- cmos technology
- low cost
- multi view
- computer science
- embedded systems
- power management
- signal processing
- image sequences
- optical flow
- digital images
- space time
- design process