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Hsiang-Yao Hsiao
Publication Activity (10 Years)
Years Active: 2013-2013
Publications (10 Years): 0
Top Topics
Multiscale
Printed Circuit Boards
High Density
Mechanical Properties
Top Venues
Microelectron. Reliab.
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Publications
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King-Ning Tu
,
Hsiang-Yao Hsiao
,
Chih Chen
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy.
Microelectron. Reliab.
53 (1) (2013)