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Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy.

King-Ning TuHsiang-Yao HsiaoChih Chen
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • mechanical properties
  • printed circuit boards
  • high speed
  • integrated circuit
  • low cost
  • mathematical model
  • vlsi implementation
  • learning algorithm
  • multiscale
  • high density
  • programmable logic