Chih Chen

Publication Activity (10 Years)

Years Active: 2006-2017
Publications (10 Years): 1

Top Topics

Printed Circuit Boards

Programmable Logic

Mechanical Properties

Top Venues

Microelectron. Reliab.

Publications

David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, King-Ning Tu
Sn in microbumps. Microelectron. Reliab. 79 (2017)
Y. W. Chang, H. Y. Peng, R. W. Yang, Chih Chen, T. C. Chang, Chau-Jie Zhan, Jin-Ye Juang, Annie T. Huang
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps. Microelectron. Reliab. 53 (1) (2013)
King-Ning Tu, Hsiang-Yao Hsiao, Chih Chen
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy. Microelectron. Reliab. 53 (1) (2013)
Y. C. Chen, Chia Wei Chu, Tzu-Yuan Chao, Y. T. Cheng, Chih Chen
The electromigration investigation of Cu-Ni nanocomposites. NEMS (2012)
Zhen-Ying Hsieh, Mu-Chun Wang, Chih Chen, Jia-Min Shieh, Yu-Ting Lin, Shuang-Yuan Chen, Heng-Sheng Huang
Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs. Microelectron. Reliab. 49 (8) (2009)
Wei-Chih Kuan, S. W. Liang, Chih Chen
Effect of bump size on current density and temperature distributions in flip-chip solder joints. Microelectron. Reliab. 49 (5) (2009)
Te Wei, Chih Chen, Krishnamurthy Surysekar
How the Perception of Project Success and Accountability Affect the IS process Document Completeness. AMCIS (2006)