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Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates.
Yi-Wun Wang
Y. W. Lin
C. Robert Kao
Published in:
Microelectron. Reliab. (2009)
Keyphrases
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mechanical properties
room temperature
finite element model
thin film
high density
low energy
genetic algorithm
evolutionary algorithm
material properties