Masatsugu Nimura

Publication Activity (10 Years)

Years Active: 2011-2016
Publications (10 Years): 1

Top Topics

Rapid Development

Evaluation Metrics

Image Compression

Top Venues

Microelectron. Reliab.

Publications

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. Microelectron. Reliab. 59 (2016)
Noboru Asahi, Yoshinori Miyamoto, Masatsugu Nimura, Yoshihito Mizutani, Yoshiyuki Arai
High productivity thermal compression bonding for 3D-IC. 3DIC (2015)
Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji
Low temperature Au-Au bonding with VUV/O3 treatment. 3DIC (2011)