High productivity thermal compression bonding for 3D-IC.
Noboru AsahiYoshinori MiyamotoMasatsugu NimuraYoshihito MizutaniYoshiyuki AraiPublished in: 3DIC (2015)
Keyphrases
- wide range
- image compression
- data compression
- infrared
- compression ratio
- compression algorithm
- data sets
- computer vision
- information systems
- evolutionary algorithm
- room temperature
- random access
- compression scheme
- image coding
- software development
- database
- high quality
- decision trees
- image processing
- genetic algorithm
- real time