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Noboru Asahi
Publication Activity (10 Years)
Years Active: 2015-2019
Publications (10 Years): 1
Top Topics
Infrared
Integrated Circuit
Room Temperature
Image Compression
Top Venues
3DIC
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Publications
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Hiroto Tanaka
,
Yoshiyuki Arai
,
Toshiyuki Jinda
,
Noboru Asahi
,
Katsumi Terada
Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process.
3DIC
(2019)
Noboru Asahi
,
Yoshinori Miyamoto
,
Masatsugu Nimura
,
Yoshihito Mizutani
,
Yoshiyuki Arai
High productivity thermal compression bonding for 3D-IC.
3DIC
(2015)