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Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process.
Hiroto Tanaka
Yoshiyuki Arai
Toshiyuki Jinda
Noboru Asahi
Katsumi Terada
Published in:
3DIC (2019)
Keyphrases
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integrated circuit
three dimensional
printed circuit boards
high speed
d objects
database
neural network
design process
vlsi implementation
analog vlsi