Login / Signup

Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process.

Hiroto TanakaYoshiyuki AraiToshiyuki JindaNoboru AsahiKatsumi Terada
Published in: 3DIC (2019)
Keyphrases
  • integrated circuit
  • three dimensional
  • printed circuit boards
  • high speed
  • d objects
  • database
  • neural network
  • design process
  • vlsi implementation
  • analog vlsi