Toshihisa Nonaka

Publication Activity (10 Years)

Years Active: 2016-2019
Publications (10 Years): 2

Top Topics

Material Properties

Stress Distribution

Finite Element Analysis

Technological Advances

Top Venues

Microelectron. Reliab.

Publications

Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka
Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. 3DIC (2019)
Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. Microelectron. Reliab. 59 (2016)