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Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package.
Koji Hamaguchi
Mitsuki Nakata
Kouta Segawa
Naoya Suzuki
Toshihisa Nonaka
Published in:
3DIC (2019)
Keyphrases
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material properties
mechanical properties
finite element
failure rate
finite element model
finite element analysis
spatially varying
soft tissue
motion analysis
motion tracking
query language
experimental data
image analysis
stress distribution