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Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection.
Masaki Ohyama
Masatsugu Nimura
Jun Mizuno
Shuichi Shoji
Toshihisa Nonaka
Yoichi Shinba
Akitsu Shigetou
Published in:
Microelectron. Reliab. (2016)
Keyphrases
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data processing
cost effective
network structure
rapid development
key technologies
technological advances
information retrieval
artificial intelligence
three dimensional
hidden markov models
evaluation metrics
evaluation criteria