Katsuaki Suganuma

Publication Activity (10 Years)

Years Active: 2007-2018
Publications (10 Years): 5

Top Topics

Thermal Conductivity

Surface Features

Probabilistic Relaxation

Electrical Properties

Top Venues

Microelectron. Reliab.

EuroHaptics (2)

Publications

Dongjin Kim, Chuantong Chen, Aiji Suetake, Chanyang Choe, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure. Microelectron. Reliab. (2018)
Chanyang Choe, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma
Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. Microelectron. Reliab. (2018)
Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma
Large-area die-attachment by silver stress migration bonding for power device applications. Microelectron. Reliab. (2018)
Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai
Power electronics packaging. Microelectron. Reliab. 55 (12) (2015)
Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. Microelectron. Reliab. 55 (12) (2015)
Katsunari Sato, Sayasa Otsubo, Teppei Araki, Tohru Sugahara, Katsuaki Suganuma
Evaluation of Stretchable Conductor for Measuring Clothing Pressure. EuroHaptics (2) (2014)
Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma
Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish. Microelectron. Reliab. 52 (11) (2012)
Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint. Microelectron. Reliab. 51 (12) (2011)
Keun-Soo Kim, Takayuki Imanishi, Katsuaki Suganuma, Minoru Ueshima, Rikiya Kato
Properties of low temperature Sn-Ag-Bi-In solder systems. Microelectron. Reliab. 47 (7) (2007)
Yasunori Tada, Masahiro Inoue, Toshimi Kawasaki, Yasushi Kawahito, Hiroshi Ishiguro, Katsuaki Suganuma
A flexible and stretchable tactile sensor utilizing static electricity. IROS (2007)
Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma
Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system. Microelectron. Reliab. 47 (8) (2007)