Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish.
Hitoshi SakuraiKeun-Soo KimKiju LeeChang-Jae KimYouichi KukimotoKatsuaki SuganumaPublished in: Microelectron. Reliab. (2012)
Keyphrases
- electron microscopy
- low energy
- mechanical properties
- x ray
- three dimensional
- thin film
- metadata
- vector field
- surface reconstruction
- surface fitting
- database
- finite element model
- surface model
- free form
- range data
- web content
- mathematical model
- multimedia
- surface features
- global illumination
- computer vision
- neural network