Hitoshi Sakurai

Publication Activity (10 Years)

Years Active: 2012-2024
Publications (10 Years): 7

Top Topics

Motion Trajectories

Top Venues

Publications

Kazufumi Kudara, Hideki Takahashi, Shintaro Sasai, Hitoshi Sakurai, Masaki Okubo, Hiroki Nakayama, Teppei Maedo, Naoki Uchiyama
Time-Optimal Motion Generation and Load-Sway Suppression for Rotary Cranes with a Two-Stage S-Curve Trajectory Based on Skilled Operation Analysis. ECC (2024)
Abdallah Farrage, Min Set Paing, Nur Azizah Amir, Kazufumi Kudara, Hideki Takahashi, Kenichi Terauchi, Shintaro Sasai, Hitoshi Sakurai, Masaki Okubo, Naoki Uchiyama
Discrete-Time Optimization of Collision-Free Rotary Crane Motion with Load-Sway Suppression. ICIT (2024)
Abdallah Farrage, Hideki Takahashi, Kenichi Terauchi, Shintaro Sasai, Hitoshi Sakurai, Masaki Okubo, Naoki Uchiyama
Algorithm for Optimal Motion Trajectory Generation of Rotary Cranes. ICM (2023)
Min Set Paing, Abdallah Farrage, Nur Azizah Amir, Hideki Takahashi, Kenichi Terauchi, Shintaro Sasai, Hitoshi Sakurai, Masaki Okubo, Naoki Uchiyama
Real-Time Modification of a Spline-Based Time-Optimal Motion Trajectory with Load-Sway Reduction for Rotary Cranes. CoDIT (2023)
Hideki Takahashi, Yusuke Ezaki, Kenichi Terauchi, Shintaro Sasai, Hitoshi Sakurai, Masaki Okubo, Naoki Uchiyama
Optimal Crane Motion Trajectory Generation Considering Energy Saving during Deceleration. SII (2022)
Abdallah Farrage, Hideki Takahashi, Kenichi Terauchi, Shintaro Sasai, Hitoshi Sakurai, Masaki Okubo, Naoki Uchiyama
Time-Optimal Trajectory Generation of Rotary Cranes with Load Sway Reduction Using Only Horizontal Boom Motion. ISIE (2021)
Tetsutaro Hashimoto, Yukihito Kawabe, Michiharu Hara, Yasushi Kakimura, Kunihiko Tajiri, Shinichiro Shirota, Ryuichi Nishiyama, Hitoshi Sakurai, Hiroshi Okano, Yasumoto Tomita, Sugio Satoh, Hideo Yamashita
An Adaptive-Clocking-Control Circuit With 7.5% Frequency Gain for SPARC Processors. IEEE J. Solid State Circuits 53 (4) (2018)
Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma
Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish. Microelectron. Reliab. 52 (11) (2012)