Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system.

Kimihiro Yamanaka Yutaka Tsukada Katsuaki Suganuma

Published in: Microelectron. Reliab. (2007)

Keyphrases

mechanical properties
electron microscopy
x ray
data sets
neural network
multimedia
three dimensional
thin film
knowledge base
decision trees
case study