Login / Signup
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.
Kiju Lee
Keun-Soo Kim
Yutaka Tsukada
Katsuaki Suganuma
Kimihiro Yamanaka
Soichi Kuritani
Minoru Ueshima
Published in:
Microelectron. Reliab. (2011)
Keyphrases
</>
electron microscopy
low cost
high speed
x ray
high density
social influence
single chip
mechanical properties
real time
data sets
website
thin film
vlsi design
main factors
analog vlsi