Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure.
Dongjin KimChuantong ChenAiji SuetakeChanyang ChoeTohru SugaharaShijo NagaoKatsuaki SuganumaPublished in: Microelectron. Reliab. (2018)
Keyphrases
- infrared
- power plant
- artificial intelligence
- thermal imaging
- room temperature
- visible spectrum
- finite element analysis
- structural information
- data mining
- air temperature
- case study
- st century
- thermal conductivity
- complex structures
- probabilistic relaxation
- thermal infrared
- neural network
- rapid development
- soft computing
- development process
- hierarchical structure
- tree structure
- knowledge based systems
- software engineering
- mobile robot
- website
- decision making
- information systems