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Large-area die-attachment by silver stress migration bonding for power device applications.

Seungjun NohHao ZhangJeyun YeomChuantong ChenCaifu LiKatsuaki Suganuma
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • power consumption
  • artificial intelligence
  • electronic devices
  • databases
  • knowledge base
  • multi agent systems
  • mobile phone
  • steady state
  • prepositional phrase