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Prediction of deformation during manufacturing processes of silicon interposer package with TSVs.

Yeonsung KimAh-Young ParkChin-Li KaoMichael SuBryan BlackSeungbae Park
Published in: Microelectron. Reliab. (2016)
Keyphrases
  • manufacturing processes
  • manufacturing systems
  • prediction accuracy
  • product quality
  • high speed
  • rapid prototyping
  • mathematical models
  • machining processes
  • real time
  • image processing