Dipak Sengupta

Publication Activity (10 Years)

Years Active: 2002-2017
Publications (10 Years): 1

Top Topics

Integrated Circuit

Simulation Study

Genetic Algorithm

Top Venues

Publications

Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, Seungbae Park
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors 17 (2) (2017)
Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta
Failure analysis of contact probe pins for SnPb and Sn applications. Microelectron. Reliab. 48 (6) (2008)
Abdul Hamid Sheikh, Salil Haldar, Dipak Sengupta
A High Precision Shell Element with Shear Deformation for the Analysis of Isotropic and Composite Shells. Int. J. Comput. Eng. Sci. 3 (3) (2002)