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A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications.
Shuai Shao
Dapeng Liu
Yuling Niu
Kathy O'Donnell
Dipak Sengupta
Seungbae Park
Published in:
Sensors (2017)
Keyphrases
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high density
real time
simulation study
data sets
statistical analysis
risk analysis
database
genetic algorithm
high speed
empirical studies
integrated circuit