Tong An

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 10

Top Topics

Security Protection

Top Venues

Microelectron. Reliab.

Proc. VLDB Endow.

IEEE Internet Things J.

Publications

Tao Zhang, Tong An, Yanzhang Geng, Zhongzheng Liu, Xin Zhao, Shuang Li
Dual-mode active noise control system with on-line identification of secondary path. Multim. Tools Appl. 82 (22) (2023)
Jinxin Zuo, Ziyu Guo, Tong An, Zhongwei Xu, Yueming Lu
A Security Resilience Metric Framework Based on the Evolution of Attack and Defense Scenarios. IEEE Internet Things J. 10 (19) (2023)
Xiaowei Chen, HeFang Jiang, Shaocheng Wu, Tao Liu, Tong An, Zhongwei Xu, Man Zhang, Muhammad Shafiq
New Generation Power System Security Protection Technology Based on Dynamic Defense. ICAIS (3) (2022)
Zhongzheng Liu, Tao Zhang, Yanzhang Geng, Tong An
Underwater Wireless High-Efficiency Energy Transmission Method Based on the Ultrasonic Transducer Array. ICCT (2021)
Tong An, Tao Zhang, Yanzhang Geng, Hai-Quan Jiao
Normalized Combinations of Proportionate Affine Projection Sign Subband Adaptive Filter. Sci. Program. 2021 (2021)
Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref
An Experimental Evaluation and Investigation of Waves of Misery in R-trees. CoRR (2021)
Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref
An Experimental Evaluation and Investigation of Waves of Misery in R-trees. Proc. VLDB Endow. 15 (3) (2021)
Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. Microelectron. Reliab. 91 (2018)
Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectron. Reliab. 91 (2018)
Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi
Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectron. Reliab. 63 (2016)
Tong An, Fei Qin
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectron. Reliab. 54 (5) (2014)
Tong An, Fei Qin, Jiangang Li
Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectron. Reliab. 51 (5) (2011)
Deqiang Wang, Mingyang Pan, Tong An, Kelun Wang, Shuyan Qu
Hamiltonian-like Properties of k-Ary n-Cubes. PDCAT (2005)