Sign in
Protrusion of electroplated copper filled in through silicon vias during annealing process.
Si Chen
Fei Qin
Tong An
Pei Chen
Bin Xie
Xunqing Shi
Published in:
Microelectron. Reliab. (2016)
Keyphrases
</>
high density
thin film
magnetic recording
semiconductor devices
plasma etching
field effect transistors
data center
integrated circuit
low cost
printed circuit boards
electron beam
real time
high speed
information systems
computer vision
genetic algorithm
databases