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Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates.

Tong AnFei Qin
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • mechanical properties
  • finite element model
  • material properties
  • finite element analysis
  • electron microscopy
  • machine learning
  • genetic algorithm
  • numerical simulations
  • finite element
  • human behavior