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Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests.
Tong An
Chao Fang
Fei Qin
Huaicheng Li
Tao Tang
Pei Chen
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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data sets
neural network
artificial intelligence
statistical analysis
experimental study
room temperature
decision trees
objective function
simulation study