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An artificial neural network approach for wafer dicing saw quality prediction.
Te-Jen Su
Yi-Feng Chen
Jui-Chuan Cheng
Chien-Liang Chiu
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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quality prediction
image quality
semiconductor manufacturing
integrated circuit
massively parallel
feature selection
real time
machine learning
real world
computer vision
decision making
classification accuracy
production system
wafer fabrication