Toh-Ming Lu

Publication Activity (10 Years)

Years Active: 2003-2018
Publications (10 Years): 1

Top Topics

Electrical Properties

Selection Mechanism

Top Venues

Microelectron. Reliab.

Publications

Sean P. Ogden, Yueming Xu, Kong Boon Yeap, Tian Shen, Toh-Ming Lu, Joel L. Plawsky
Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. Microelectron. Reliab. 91 (2018)
Sean P. Ogden, Juan Borja, Huawei Zhou, Joel L. Plawsky, Toh-Ming Lu, William N. Gill
A moisture-related breakdown mechanism in low-k dielectrics using a multiple I-V ramp test. IRPS (2015)
Ming He, Huafang Li, Pei-I Wang, Toh-Ming Lu
Bias-temperature stress of Al on porous low-k dielectrics. Microelectron. Reliab. 51 (8) (2011)
Ming He, C. Gaire, G.-C. Wang, Toh-Ming Lu
Study of metal adhesion on porous low-k dielectric using telephone cord buckling. Microelectron. Reliab. 51 (4) (2011)
Kwang-Su Lee, Toh-Ming Lu, Xicheng Zhang
The measurement of the dielectric and optical properties of nano thin films by THz differential time-domain spectroscopy. Microelectron. J. 34 (1) (2003)