Asit Kumar Gain

Publication Activity (10 Years)

Years Active: 2009-2018
Publications (10 Years): 2

Top Topics

Mechanical Properties

Loading Conditions

Finite Element Model

Photometric Stereo

Top Venues

Microelectron. Reliab.

Publications

Asit Kumar Gain, Liangchi Zhang
High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material. Microelectron. Reliab. 83 (2018)
Asit Kumar Gain, Liangchi Zhang
-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity. Microelectron. Reliab. 87 (2018)
Asit Kumar Gain, Y. C. Chan
composite solders. Microelectron. Reliab. 54 (5) (2014)
Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung
composite solder on flexible ball grid array substrates. Microelectron. Reliab. 51 (5) (2011)
Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung
nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 51 (12) (2011)
Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain, Y. C. Chan
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. Microelectron. Reliab. 50 (8) (2010)
Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung
additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 50 (12) (2010)
Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. Microelectron. Reliab. 49 (7) (2009)