Y. C. Chan

Publication Activity (10 Years)

Years Active: 1985-2016
Publications (10 Years): 1

Top Topics

Mechanical Properties

Radio Frequency Identification Rfid

Top Venues

Microelectron. Reliab.

IPDPS Workshops

Publications

M. Sobczak-Edmans, T. H. B. Ng, Y. C. Chan, E. Chew, Kai-Hsiang Chuang, Shen-Hsing Annabel Chen
Temporal dynamics of visual working memory. NeuroImage 124 (2016)
Asit Kumar Gain, Y. C. Chan
composite solders. Microelectron. Reliab. 54 (5) (2014)
Johanna Virkki, Toni Björninen, T. Kellomäki, Sari Merilampi, I. Shafiq, Leena Ukkonen, Lauri Sydänheimo, Y. C. Chan
Reliability of washable wearable screen printed UHF RFID tags. Microelectron. Reliab. 54 (4) (2014)
Zahid Ullah, Manish Kumar Jaiswal, Y. C. Chan, Ray C. C. Cheung
FPGA Implementation of SRAM-based Ternary Content Addressable Memory. IPDPS Workshops (2012)
Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung
composite solder on flexible ball grid array substrates. Microelectron. Reliab. 51 (5) (2011)
Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung
nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 51 (12) (2011)
Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain, Y. C. Chan
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. Microelectron. Reliab. 50 (8) (2010)
Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung
additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 50 (12) (2010)
Y. C. Chan, W. A. Johnson, S. K. Karuza, A. M. Young, J. C. Camparo
Self-Monitoring and Self-Assessing Atomic Clocks. IEEE Trans. Instrum. Meas. 59 (2) (2010)
Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. Microelectron. Reliab. 49 (7) (2009)
Jun Shen, Y. C. Chan
Research advances in nano-composite solders. Microelectron. Reliab. 49 (3) (2009)
Sachin Kumar, Myra Torres, Y. C. Chan, Michael G. Pecht
A hybrid prognostics methodology for electronic products. IJCNN (2008)
R. Smit, A. L. Brown, Y. C. Chan
Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow? Environ. Model. Softw. 23 (10-11) (2008)
Rashed Adnan Islam, Y. C. Chan, W. Jillek, Samia Islam
Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. Microelectron. J. 37 (8) (2006)
M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45 (3-4) (2005)
C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectron. Reliab. 44 (5) (2004)
Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. Microelectron. Reliab. 44 (2) (2004)
M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. Microelectron. Reliab. 44 (3) (2004)
Rashed Adnan Islam, Y. C. Chan
Effect of microwave preheating on the bonding performance of flip chip on flex joint. Microelectron. Reliab. 44 (5) (2004)
N. H. Yeung, Victor Lau, Y. C. Chan
Bias-HAST on tape ball grid array (TBGA) test pattern. Microelectron. Reliab. 44 (4) (2004)
S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan
Thermal stability performance of anisotropic conductive film at different bonding temperatures. Microelectron. Reliab. 44 (3) (2004)
J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. Microelectron. Reliab. 43 (8) (2003)
C. W. Tan, Y. C. Chan, N. H. Yeung
Behaviour of anisotropic conductive joints under mechanical loading. Microelectron. Reliab. 43 (3) (2003)
M. N. Islam, Y. C. Chan, Ahmed Sharif, M. O. Alam
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. Microelectron. Reliab. 43 (12) (2003)
Chunyan Yin, M. O. Alam, Y. C. Chan, Chris Bailey, Hua Lu
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43 (4) (2003)
C. W. Tan, Y. C. Chan, N. H. Yeung
Effect of autoclave test on anisotropic conductive joints. Microelectron. Reliab. 43 (2) (2003)
M. O. Alam, Y. C. Chan, K. C. Hung
Reliability study of the electroless Ni-P layer against solder alloy. Microelectron. Reliab. 42 (7) (2002)
S. H. Fan, Y. C. Chan
Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications. Microelectron. Reliab. 42 (7) (2002)
C. F. Luk, Y. C. Chan, K. C. Hung
Application of adhesive bonding techniques in hard disk drive head assembly. Microelectron. Reliab. 42 (4-5) (2002)
C. F. Luk, Y. C. Chan, K. C. Hung
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microelectron. Reliab. 42 (3) (2002)
Y. W. Chiu, Y. C. Chan, S. M. Lui
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectron. Reliab. 42 (12) (2002)
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42 (8) (2002)
Y. C. Chan, D. Y. Luk
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. Microelectron. Reliab. 42 (8) (2002)
Y. C. Chan, D. Y. Luk
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. Microelectron. Reliab. 42 (8) (2002)
P. L. Tu, Y. C. Chan, K. C. Hung
Reliability of microBGA assembly using no-flow underfill. Microelectron. Reliab. 41 (12) (2001)
Y. C. Chan, P. L. Tu, K. C. Hung
Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectron. Reliab. 41 (11) (2001)
P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
Study of micro-BGA solder joint reliability. Microelectron. Reliab. 41 (2) (2001)
Y. C. Chan
FORTLOG = Fortran + Logique. SPLT (1985)