Hua Lu

Publication Activity (10 Years)

Years Active: 2002-2018
Publications (10 Years): 2

Top Topics

Material Properties

Stress Distribution

Visual Cryptography

Top Venues

Microelectron. Reliab.

Publications

Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectron. Reliab. 87 (2018)
Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectron. Reliab. 68 (2017)
Hua Lu, Jack Peterson
False shares in verifiable secret sharing with finite field commitments. CoRR (2015)
Pushparajah Rajaguru, Hua Lu, Chris Bailey
Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectron. Reliab. 55 (6) (2015)
Pushparajah Rajaguru, Hua Lu, Chris Bailey
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectron. Reliab. 55 (11) (2015)
Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov
Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectron. Reliab. 51 (5) (2011)
E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliab. 50 (9-11) (2010)
Hua Lu, Chris Bailey, Chunyan Yin
Design for reliability of power electronics modules. Microelectron. Reliab. 49 (9-11) (2009)
M. J. Rizvi, Chris Bailey, Hua Lu
Failure mechanisms of ACF joints under isothermal ageing. Microelectron. J. 39 (9) (2008)
M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45 (3-4) (2005)
Chunyan Yin, M. O. Alam, Y. C. Chan, Chris Bailey, Hua Lu
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43 (4) (2003)
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42 (8) (2002)