Chris Bailey

Publication Activity (10 Years)

Years Active: 2002-2024
Publications (10 Years): 13

Top Topics

Failure Prediction

Predictive Analytics

Software Components

Top Venues

Microelectron. Reliab.

IEEE Trans. Ind. Electron.

Publications

Pushparajah Rajaguru, Tim Tilford, Chris Bailey, Stoyan Stoyanov
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module. IEEE Access 12 (2024)
Stoyan Stoyanov, Chris Bailey
Modeling Insights Into the Assembly Challenges of Focal Plane Arrays. IEEE Access 11 (2023)
Mominul Ahsan, Stoyan Stoyanov, Chris Bailey, Alhussein Albarbar
Developing Computational Intelligence for Smart Qualification Testing of Electronic Products. IEEE Access 8 (2020)
Fateme Dinmohammadi, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu
Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications. IEEE Access 7 (2019)
Stoyan Stoyanov, Mominul Ahsan, Chris Bailey, Tracy Wotherspoon, Craig Hunt
Predictive analytics methodology for smart qualification testing of electronic components. J. Intell. Manuf. 30 (3) (2019)
Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin
Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Comput. Sci. 9 (1) (2019)
Jamie Blanche, David Flynn, Helen Lewis, Gary D. Couples, Jim Buckman, Chris Bailey, Tim Tilford
Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radar. IEEE Access 6 (2018)
Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectron. Reliab. 87 (2018)
Tim Tilford, Stoyan Stoyanov, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey
Design, manufacture and test for reliable 3D printed electronics packaging. Microelectron. Reliab. 85 (2018)
Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, F. Udrea
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectron. Reliab. 83 (2018)
Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectron. Reliab. 68 (2017)
Jose Angel Ortiz Gonzalez, Olayiwola Alatise, Attahir Murtala Aliyu, Pushparajah Rajaguru, Alberto Castellazzi, Li Ran, Philip Mawby, Chris Bailey
Evaluation of SiC Schottky Diodes Using Pressure Contacts. IEEE Trans. Ind. Electron. 64 (10) (2017)
Stoyan Stoyanov, Chris Bailey, Georgios Tourloukis
Similarity approach for reducing qualification tests of electronic components. Microelectron. Reliab. 67 (2016)
Pushparajah Rajaguru, Hua Lu, Chris Bailey
Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectron. Reliab. 55 (6) (2015)
Pushparajah Rajaguru, Hua Lu, Chris Bailey
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectron. Reliab. 55 (11) (2015)
Stoyan Stoyanov, Chris Bailey
Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectron. Reliab. 55 (9-10) (2015)
Chunyan Yin, Chris Best, Chris Bailey, Stoyan Stoyanov
Statistical analysis of the impact of refinishing process on leaded components. Microelectron. Reliab. 55 (2) (2015)
Bozena Kaminska, Bernard Courtois, Chris Bailey
New topic session 2B: Co-design and reliability of power electronic modules - Current status and future challenges. VTS (2014)
Mahera Musallam, Chunyan Yin, Chris Bailey, C. Mark Johnson
Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules. Microelectron. Reliab. 54 (1) (2014)
Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott
Modelling methodology for thermal analysis of hot solder dip process. Microelectron. Reliab. 53 (8) (2013)
Thamo Sutharssan, Stoyan Stoyanov, Chris Bailey, Yasmine Z. Rosunally
Prognostics and Health Monitoring of High Power LED. Micromachines 3 (1) (2012)
Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov
Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectron. Reliab. 51 (5) (2011)
Yasmine Z. Rosunally, Stoyan Stoyanov, Chris Bailey, Peter Mason, Sheelagh Campbell, George Monger, Ian Bell
Fusion Approach for Prognostics Framework of Heritage Structure. IEEE Trans. Reliab. 60 (1) (2011)
E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliab. 50 (9-11) (2010)
Hua Lu, Chris Bailey, Chunyan Yin
Design for reliability of power electronics modules. Microelectron. Reliab. 49 (9-11) (2009)
M. J. Rizvi, Chris Bailey, Hua Lu
Failure mechanisms of ACF joints under isothermal ageing. Microelectron. J. 39 (9) (2008)
Keith I. Sinclair, Tim Tilford, Marc P. Y. Desmulliez, George Goussetis, Chris Bailey, Kevin Parrott, Alan J. Sangster
Open Ended Microwave Oven for Packaging CoRR (2008)
Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez
Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. Microelectron. Reliab. 47 (1) (2007)
Stephen Ridout, Milos Dusek, Chris Bailey, Chris Hunt
Assessing the performance of crack detection tests for solder joints. Microelectron. Reliab. 46 (12) (2006)
M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45 (3-4) (2005)
Chunyan Yin, M. O. Alam, Y. C. Chan, Chris Bailey, Hua Lu
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43 (4) (2003)
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42 (8) (2002)