Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Pushparajah RajaguruHua LuChris BaileyJose Angel Ortiz GonzalezOlayiwola AlatisePublished in: Microelectron. Reliab. (2017)
Keyphrases
- finite element analysis
- finite element
- high speed
- mechanical properties
- material properties
- finite element model
- power dissipation
- computer aided design
- stress distribution
- using artificial neural networks
- low cost
- chip design
- failure rate
- host computer
- experimental data
- printed circuit boards
- image processing
- high density
- power management
- ibm power processor
- neural network
- boundary conditions
- evaluation method
- numerical simulations
- power consumption
- computer graphics
- database systems
- artificial intelligence
- genetic algorithm