Login / Signup

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.

Chunyan YinM. O. AlamY. C. ChanChris BaileyHua Lu
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • high speed
  • genetic algorithm
  • database systems
  • low cost
  • web applications
  • anisotropic diffusion
  • diffusion process