M. O. Alam

Publication Activity (10 Years)

Years Active: 2002-2013
Publications (10 Years): 0

Top Topics

Qualitative And Quantitative

Failure Modes And Effects

Experimental Study

Top Venues

Microelectron. Reliab.

Publications

Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott
Modelling methodology for thermal analysis of hot solder dip process. Microelectron. Reliab. 53 (8) (2013)
Kenny C. Otiaba, R. S. Bhatti, Ndy N. Ekere, Sabuj Mallik, M. O. Alam, Emeka H. Amalu, Mathias Ekpu
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectron. Reliab. 52 (7) (2012)
Kenny C. Otiaba, Ndy N. Ekere, R. S. Bhatti, Sabuj Mallik, M. O. Alam, Emeka H. Amalu
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectron. Reliab. 51 (12) (2011)
Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. Microelectron. Reliab. 44 (2) (2004)
M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. Microelectron. Reliab. 44 (3) (2004)
J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. Microelectron. Reliab. 43 (8) (2003)
M. N. Islam, Y. C. Chan, Ahmed Sharif, M. O. Alam
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. Microelectron. Reliab. 43 (12) (2003)
Chunyan Yin, M. O. Alam, Y. C. Chan, Chris Bailey, Hua Lu
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43 (4) (2003)
M. O. Alam, Y. C. Chan, K. C. Hung
Reliability study of the electroless Ni-P layer against solder alloy. Microelectron. Reliab. 42 (7) (2002)