Kenny C. Otiaba

Publication Activity (10 Years)

Years Active: 2011-2014
Publications (10 Years): 0

Top Topics

Composite Materials

Solder Ball Connect

Top Venues

Microelectron. Reliab.

Microelectron. J.

Publications

Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba
The effect of thermal constriction on heat management in a microelectronic application. Microelectron. J. 45 (2) (2014)
Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectron. Reliab. 54 (1) (2014)
Kenny C. Otiaba, R. S. Bhatti, Ndy N. Ekere, Sabuj Mallik, M. O. Alam, Emeka H. Amalu, Mathias Ekpu
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectron. Reliab. 52 (7) (2012)
Kenny C. Otiaba, Ndy N. Ekere, R. S. Bhatti, Sabuj Mallik, M. O. Alam, Emeka H. Amalu
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectron. Reliab. 51 (12) (2011)