Login / Signup

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device.

Kenny C. OtiabaR. S. BhattiNdy N. EkereSabuj MallikM. O. AlamEmeka H. AmaluMathias Ekpu
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • high speed
  • empirical studies
  • experimental study
  • qualitative and quantitative
  • real time
  • neural network
  • control system
  • pattern mining