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Mathias Ekpu
ORCID
Publication Activity (10 Years)
Years Active: 2012-2014
Publications (10 Years): 0
Top Topics
Composite Materials
Everyday Life
Solder Ball Connect
Heat Transfer
Top Venues
Microelectron. Reliab.
Microelectron. J.
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Publications
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Mathias Ekpu
,
Raj S. Bhatti
,
Michael I. Okereke
,
Sabuj Mallik
,
Kenny C. Otiaba
The effect of thermal constriction on heat management in a microelectronic application.
Microelectron. J.
45 (2) (2014)
Mathias Ekpu
,
Raj S. Bhatti
,
Michael I. Okereke
,
Sabuj Mallik
,
Kenny C. Otiaba
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Microelectron. Reliab.
54 (1) (2014)
Kenny C. Otiaba
,
R. S. Bhatti
,
Ndy N. Ekere
,
Sabuj Mallik
,
M. O. Alam
,
Emeka H. Amalu
,
Mathias Ekpu
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device.
Microelectron. Reliab.
52 (7) (2012)