Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Mathias EkpuRaj S. BhattiMichael I. OkerekeSabuj MallikKenny C. OtiabaPublished in: Microelectron. Reliab. (2014)
Keyphrases
- mechanical properties
- composite materials
- high temperature
- thermal conductivity
- cross section
- user interface
- infrared
- user friendly
- visual interface
- solder ball connect
- neural network
- everyday life
- interface design
- daily life
- friendly interface
- line drawings
- learning materials
- power consumption
- line segments
- website
- e learning