M. A. Uddin

Publication Activity (10 Years)

Years Active: 2004-2004
Publications (10 Years): 0

Publications

M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. Microelectron. Reliab. 44 (3) (2004)