K. C. Hung

Publication Activity (10 Years)

Years Active: 2001-2002
Publications (10 Years): 0

Publications

M. O. Alam, Y. C. Chan, K. C. Hung
Reliability study of the electroless Ni-P layer against solder alloy. Microelectron. Reliab. 42 (7) (2002)
C. F. Luk, Y. C. Chan, K. C. Hung
Application of adhesive bonding techniques in hard disk drive head assembly. Microelectron. Reliab. 42 (4-5) (2002)
C. F. Luk, Y. C. Chan, K. C. Hung
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microelectron. Reliab. 42 (3) (2002)
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42 (8) (2002)
P. L. Tu, Y. C. Chan, K. C. Hung
Reliability of microBGA assembly using no-flow underfill. Microelectron. Reliab. 41 (12) (2001)
Y. C. Chan, P. L. Tu, K. C. Hung
Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectron. Reliab. 41 (11) (2001)
P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
Study of micro-BGA solder joint reliability. Microelectron. Reliab. 41 (2) (2001)