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Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages.
Y. P. Wu
M. O. Alam
Y. C. Chan
B. Y. Wu
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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low cost
high speed
analog vlsi
programmable logic
high density
dynamic environments
single chip
video sequences
human body
data sets
circuit design
anisotropic diffusion
functional verification
host computer
solid models
image sensor
low power
three dimensional
genetic algorithm
neural network