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Modelling methodology for thermal analysis of hot solder dip process.

Stoyan StoyanovChris BaileyM. O. AlamChunyan YinChris BestPeter TollafieldRob CrawfordMike ParkerJim Scott
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • process model
  • data analysis
  • statistical analysis
  • failure modes and effects
  • real time
  • machine learning
  • computer vision
  • expert systems
  • conceptual model
  • quantitative analysis
  • step wise