Peter Tollafield

Publication Activity (10 Years)

Years Active: 2013-2013
Publications (10 Years): 0

Top Topics

Failure Modes And Effects

Quantitative Analysis

Top Venues

Microelectron. Reliab.

Publications

Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott
Modelling methodology for thermal analysis of hot solder dip process. Microelectron. Reliab. 53 (8) (2013)