Login / Signup

Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables.

Pushparajah RajaguruH. LuChris BaileyAlberto CastellazziV. PathiranaN. UdugampolaF. Udrea
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • computational model
  • high speed
  • formal model
  • high level
  • low cost
  • theoretical analysis
  • mathematical model
  • experimental data
  • discrete data
  • probabilistic model
  • simulation model
  • parameter identification