N. W. Leung

Publication Activity (10 Years)

Years Active: 2004-2004
Publications (10 Years): 0

Publications

C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectron. Reliab. 44 (5) (2004)